USPTO Patents Application 10830069

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PATENT ABSTRACTS OF JAPAN

(1 1 publication number : 2001 -002747

(43)Date of publication of application : 09.01.2001

(51)Int.CI.

C08G 18/02
C08J 5/18
C08L 79/00
// C08L 79:00

(21) Application number : 11-170518

(22) Date of filing: 17.06.1999

(71) Applicant

(72) Inventor :

NITTO DENKO CORP

HIKITA TAKAMI
SAKAMOTO YUKIE
MOCHIZUKI SHU
MISUMI SADAHITO
SATSUMA MICHIO

(54) AROMATIC POLYCARBODIIMIDE AND ITS SHEET

(57)Abstract:

PROBLEM TO BE SOLVED: To obtain an aromatic
polycarbodiimide polymer that has excellent solubility in organic
solvents, shows high heat resistance and is useful for sheets,
adhesives and the like, by polymerizing a specific diisocynate in
the presence of a phosphorus based catalyst.
SOLUTION: A diisocyanate monomer, preferably a compound of
formula I and a catalyst (for example, a 1-phenyl-2-
phospholene-1 -oxide, or the like) are added to an organic
solvent (for example, tetrachloroethylene) and are polymerized,
preferably at 40-1 50°C to prepare the objective polymer
represented by formula II ((n) is 2-300). In the polymerization,
the concentration of the diisocyanate is preferably adjusted to

1-70 wt.%. The compound of formula I is prepared by allowing a -^^^^yS^y^^
halogenated formate to react with a diamine corresponding to I /-v^^^>--\"^ j TT
the compound to form a dicarbamate and thermally \ VV w / m

decomposing the dicarbamate with a silicon halide compound.

LEGAL STATUS

[Date of request for examination] 14.1 1 .2005

[Date of sending the examiner's decision of

rejection]

[Kind of final disposal of application other than the

examiner's decision of rejection or application

converted registration]

[Date of final disposal for application]

[Patent number]

[Date of registration]

[Number of appeal against examiners decision of
rejection]

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JP,200 1-002747, A [CLAIMS]

Page 1 of 1

* NOTICES *

JPO and NCIPI are not responsible for any
damages caused by the use of this translation.

1 .This document has been translated by computer. So the translation may not reflect the original precisely.
2.**** shows the word which can not be translated.
3. In the drawings, any words are not translated.

CLAIMS

[Claim(s)]

[Claim 1] Bottom type (I): [Formula 1]

(n means the integer of 2-300 among a formula.) The aromatic series poly carbodiimide which has the
configuration unit expressed.

[Claim 2] The poly carbodiimide solution which comes to dissolve the aromatic series poly carbodiimide of
claim 1 in an organic solvent.

[Claim 3] The poly carbodiimide sheet which consists of an aromatic series poly carbodiimide of claim 1 .

[Translation done.]

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JP,2001-002747,A [DETAILED DESCRIPTION]

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* NOTICES *

JPO and NCI PI are not responsible for any
damages caused by the use of this translation.

1 .This document has been translated by computer. So the translation may not reflect the original precisely.

2 **** s h ows the word which can not be translated.
3. In the drawings, any words are not translated.

DETAILED DESCRIPTION

[Detailed Description of the Invention]
[0001]

[Background of the Invention] This invention relates to a new aromatic series poly carbodiimide. The
aromatic series poly carbodiimide of this invention can be used as the sheet (film) which has properties
which were excellent in versatility, such as high thermal resistance, low hygroscopicity, and a low dielectric
constant, adhesives, and a moldings.

[0002] What made the monomer conventionally diphenylmethane diisocyanate (MDI), tolylene diisocyanate
(TDI), etc., and carried out the polymerization of this to the aromatic series poly carbodiimide is known.
Such a poly carbodiimide is used by the outstanding thermal resistance as a fire resistance-ized film or heat-
resistant adhesives.
[0003]

[Objects and Summary of the Invention] Although these poly carbodiimide film has thermal resistance in
that neither volatile gas nor a decomposition monomer is generated even if it puts it to an elevated
temperature 400 degrees C or more, when moisture resistance is low or heat-treats above 200 degrees C, it
does not have self-hold nature, it becomes weak, and does not bear practical use. Moreover, the solubility of
workability over an organic solvent is deficiently low.

[0004] this invention persons repeated various examination that the fault of such a conventional poly
carbodiimide should be canceled. Consequently, knowledge that said technical problem can be solved by the
poly carbodiimide which has the following new frame is acquired, and it came to complete this invention.
[0005] namely, this invention — bottom type (I): — [Formula 2]

(I)

(— n means the integer of 2-300 among a formula.) — the aromatic series poly carbodiimide which has the
configuration unit expressed is offered.

[0006] This polymer is a new high molecular compound, has high thermal resistance with the outstanding
solubility, and is excellent also in an adhesive property, cold working nature, and moisture resistance.
[0007]

[Detailed Description of the Invention] the poly carbodiimide of the invention in this application — bottom
type (II): [Formula 3]

It is obtained by coming out, making the diisocyanate expressed into a monomer, and carrying out the
polymerization of this by the well-known approach in itself under existence of the Lynn system catalyst. In
addition, the monomer type (II) used as the raw material of the poly carbodiimide of this invention is a new
molecular entity.

[0008] The poly carbodiimide of this invention uses as a raw material diamine shown in JP,3-90052,A by
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JP.200 1-002747, A [DETAILED DESCRIPTION]

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the bottom formula (III) of an indication, isocyanate-izes this by the well-known approach, and,
subsequently can be manufactured by performing a polymerization.
[0009]
[Formula 4]

"*~o-~o-Eq-°- o~ _

cT Id

[0010] (Manufacture of a monomer) The method of making a phosgene, diphenyl carbonate, or
carbonyldiimidazole act on corresponding diamine as an approach of obtaining the diisocyanate expressed
with said formula (II) from such diamine, or the approach of manufacturing by the Cutius rearrangement
from dicarboxylic acid is mentioned. Furthermore, as other approaches, make halogenation formate, such as
alkyl halide formate or aryl halide formate, act on a diamine compound, and dicarbamate is compounded,
the approach (JP,10-158394,A --) of using halogenation silicon compounds, such as chlorosilicane, for this
as an activation reagent, and diisocyanate-izing by the pyrolysis G.Greber.et.al., Angew.Chem.Int.Ed.,
There is the approach (V. L.KValli.et.al., J.Org.Chem., Vol. 60,257 (1995)) of diisocyanate-izing using
Vol.17, No. 12, and 941 (1968) and catechol borane. These approaches are more desirable from the point of
yield and safety.

[001 1] (Manufacture of a carver mate) Direct halogenation formate may be made to react to diamine under
existence of the third class amine, and after activating diamine as silanizing diamine, halogenation formate
may be made in manufacturing a carver mate first, to react. Below, how to obtain isocyanate by making
silanizing diamine into activity intermediate field is further stated to a detail.

[0012] (Composition of silanizing diamine) As the silanizing approach of this diamine compound the
method of making an organic halogenation silicon compound act on the diamine which corresponds under
existence of a basic compound is used (Oishi, et.al.Macromoleculesx, 21, and 547 (1988) — ) Oishi,
et.al.J.ofPolym.Sci., Part A, 25, 2493 (1987), Oishi, et.al.Macromol.Chem., Rapid Commun., 12, and 465
(1991). That is, although compounded by the corresponding diamine compound an organic halogenation
silicon compound and by making chlorosilicanes, such as trimethylchlorosilane, triethyl chlorosilicane, and
trimethoxy chlorosilicane, specifically act, Men of the ease of treating or economical efficiency to
trimethylchlorosilane is the most suitable. Moreover, the approach using hexamethyldisilazane is also
employable.

[0013] These organic halogenation silicon compounds may be used independently, and two or more sorts
may be mixed and used. The amount of the organic halogenation silicon compound used has 1 .5 to 3.4 good
times of the number of mols of diamine, and its 1 .8 to 3.0 times are more desirable. If there is less amount
used than this, since a reaction does not advance completely, it is not desirable. It is difficult to, remove an
unreacted organic halogenation silicon compound after reaction termination on the other hand, if [ than said
range ] more, and it is not desirable.

[0014] What is necessary is for the solvent used for these reactions just to dissolve diamine. For example,
aromatic hydrocarbon system solvents, such as ester system compound; toluene [, such as ketone system
compound; ethyl acetate, ], such as ether system compound; acetones, such as tetrahydrofurane (THF),
dioxane, and diethylether, a methyl ethyl ketone, and methyl isobutyl ketone, a xylene, and benzene;
halogenated hydrocarbon, such as chloroform, a methylene chloride, and tetrachloroethylene, etc. is
mentioned. These solvents may be used independently, and two or more sorts may be mixed and they may
be used.

[0015] The diamine concentration in a reaction mixture is 10 - 30% the optimal 5 to 40% preferably 1 to
50%. If the above-mentioned concentration is too low, a reaction takes time amount and it is not practical. If
concentration is too high, the side reaction which is not desirable will be caused, or there is a possibility that
control of a reaction may become difficult. 0-150 degrees C of reaction temperature are 20-130 degrees C
preferably. A reaction is hard to go on and is not practical if reaction temperature is lower than this.
Moreover, selection of a solvent is difficult for reaction temperature higher than this, and side reaction, such
as condensation, may be produced.

[0016] As a basic compound which carries out the trap of the hydrogen chloride generated by the reaction,
each of organic bases and inorganic bases can be used that what is necessary is just what dissolves in the
used solvent and does not check a reaction. The point of being easy to dissolve in a solvent to an organic

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base is desirable. The third class amines, such as triethylamine, a pyridine, 1, 8-diazabicyclo [5.4.0]-7-
undecene, a collidine, picoline, and a lutidine, are desirable especially from the point which does not check a
reaction. The amount of the base used has 1 .5 to 3.4 good times of the number of use mols of diamine, and
its 1.8 to 3.0 times are more desirable.

[0017] (Composition of silanizing diamine to diisocyanate) Next halogenation formate is made to react to
silanizing diamine, and it considers as a carver mate compound. Although methyl chloro formate, ethyl
chloro formate, phenyl chloro formate, p-nitrophenyl chloro formate, etc. are used, in order to obtain the
urethane fully activated for obtaining the poly carbodiimide as halogenation formate, phenyl chloro formate
or p-nitrophenyl chloro formate is more suitable. These halogenation formate may be used independently
and they may use two or more sorts. Or by using two or more sorts of halogenation chloro formate, one of
the two can make the inactive unsymmetrical urethane compound able to generate beforehand to isocyanate-
izing, and this can also be used as an alternative compound of end encapsulant.
[0018] -40 degrees C - 100 degrees C, although reaction temperature is -20 degrees C - 80 degrees C
preferably, in order to prevent side reaction, it may react, cooling suitably by an ice bath etc. The amount of
the halogenation formate used has 1 .5 to 3.4 good times of the number of mols of diamine, and its 1 .8 to 3.0
times are good the optimal. It is not desirable in order to trigger side reaction which unreacted diamine or
silanizing diamine remains in a system, and is subsequently generated, such as isocyanate and ureapoiesis, if
there is too little amount used. If many [ too ], it is difficult after reaction termination to remove out of a
system. The reaction of silanizing diamine and halogenation formate follows on going on, and an organic
halogenation silicon compound is reproduced. The organic halogenation silicon compound reproduced here
acts as an activation reagent of the next isocyanate-ized reaction. As a basic compound which promotes a
reaction in case isocyanate is generated from a carver mate compound, basic high tertiary amine, such as
triethylamine, is more desirable comparatively. 0 degree C - 160 degrees C of reaction temperature of
isocyanate-izing are 20 degrees C - 140 degrees C preferably. At low temperature 0 degree C or less, a
reaction may not advance and the side reaction of a resultant decomposing may arise in an elevated
temperature 160 degrees C or more. The amount of the base used has 1.5 to 3.4 good times of the number of
mols of diamine to be used, and its 1.8 to 3.0 times are good the optimal. The diisocyanate compounded in
this way next is isolated and refined, or a polymerization is carried out as it is, and the poly carbodiimide is
obtained.

[0019] (Manufacture of the poly carbodiimide from diisocyanate) In order to manufacture the poly
carbodiimide of this invention The diisocyanate monomer expressed with said formula (II) may be used
independently. The organic diisocyanate of others [ the range which does not spoil the property of the poly
carbodiimide of this invention ], For example, 4 and 4 f -diphenylmethane diisocyanate, 2, 6-tolylene
diisocyanate, 2, 4-tolylene diisocyanate, 1 -methoxypheny -2, 4-diisocyanate, 3, 3'-dimethoxy -4, 4'-
diphenylmethane diisocyanate, 4 and 4 f -diphenyl ether diisocyanate, 3,3'-dimethyl-4,4'-
diphenyletherdiisocyanate, You may copolymerize with an o-tolylene diisocyanate, 2, and 2-bis[4-(4-
isocyanate phenoxy) phenyl] hexafluoropropane, 2, and 2-bis[4-(4-isocyanate phenoxy) phenyl] propane
etc.

[0020] the diisocyanate monomer to which a copolymerization ratio is expressed with a formula (II) —
receiving - 1 - 90-mol% — more — desirable — 1 - 70-mol% — it is 1 - 50-mol% most preferably. If a
copolymerization ratio exceeds 90-mol%, the property of the poly carbodiimide of this invention may be
lost. Moreover, to the poly carbodiimide of this invention, at a rate of 1 / 100 - 100/1, it may mix in the state
of a varnish, and other poly carbodiimides may be used.

[0021] Polymerization temperature has desirable 40-150 degrees C, and is more desirable. [ of 50-140
degrees C ] Reaction time becomes long too much and is not practical if reaction temperature is lower than
40 degrees C. Moreover, selection of a solvent is difficult for the reaction temperature exceeding 150
degrees C.

[0022] The diisocyanate monomer concentration in the poly carbodiimide composition is 15 - 50% most
preferably 5 to 60% one to 70% of the weight (only henceforth %). If monomer concentration is lower than
1%, carbodiimide-ization may not advance. Moreover, control of a reaction will become difficult if 70% is
exceeded.

[0023] The organic solvent used for the time of composition of the poly carbodiimide and the poly
carbodiimide solution may be conventionally well-known. Specifically, aromatic hydrocarbon system
solvents, such as cyclic ether system solvents, such as ketone solvent, such as halogenated hydrocarbon,
such as tetrachloroethylene, 1,2-dichloroethane, chloroform, and dichloromethane, an acetone, a methyl
ethyl ketone, methyl isobutyl ketone, and a cyclohexanone, a tetrahydrofuran, and dioxane, toluene, and a

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xylene, are mentioned. These may be used independently, and may mix and use two or more sorts.
[0024] Each Lynn system catalyst well-known as a catalyst used for carbodiimide-ization is used suitably,
for example, phospholene oxide, such as l-phenyl-2-phospholene-l -oxide, 3 -methyl -2-phospholene-l-
oxide, l-ethyl-2-phospholene-l -oxide, 3 -methyl- 1 -phenyl -2-phospholene-l -oxide, or these 3 -phospholene
isomers, is mentioned.

[0025] In addition, in the formation of a carver mate of the aforementioned diamine, diisocyanate-izing, and
carbodiimide-izing, isolation and purification may be performed at each process and you may advance
gradually, and in one reaction container, these processes may be continued and you may carry out as a series
of reactions.

[0026] Moreover, it may continue for the last stage of a polymerization reaction, the middle, or the first
stage at large, mono-isocyanate may be added, and end blockade processing may be carried out. As such
mono-isocyanate, phenyl isocyanate, p-nitrophenyl isocyanate, p- and m-tolyl isocyanate, p-formylphenyl
isocyanate, p-isopropyl phenyl isocyanate, 1 -naphthyl isocyanate, etc. can be used. Thus, the obtained poly
carbodiimide solution is excellent in the preservation stability of a solution.

[0027] Moreover, reaction mixture may be supplied to poor solvents, such as low-grade hydrocarbons, such
as lower alcohol, such as a methanol, ethanol, and isopropyl alcohol, a hexane, a heptane, and a pentane,
after reaction termination, the poly carbodiimide may be deposited as precipitation, and an unreacted
monomer and an unreacted catalyst may be removed. In order to prepare the solution of the poly
carbodiimide, predetermined actuation performs washing and desiccation and the polymer which deposited
as precipitate is again dissolved in an organic solvent. The solution stability of the poly carbodiimide can be
raised by performing such actuation.

[0028] Moreover, the by-product contained in a polymer solution may be made to stick to a suitable
adsorbent etc., and may be refined, independent [ in alumina gel, silica gel, activated carbon, a zeolite,
activity magnesium oxide, an activity bauxite, a FURASU ground, the activated clay, molecular sieve
carbon, etc. ] as an adsorbent — or it can use together and use.

[0029] the polymerization degree n of the poly carbodiimide of this invention ~ 2-300 - it is 4-100
preferably. If n is larger than this, in neglect in ordinary temperature, from several minutes, it gels easily in
several hours and is not desirable practically. Moreover, if molecular weight is smaller than this, it is not
missing [ of a coat ], and desirable.

[0030] (Manufacture of a film and an adhesion sheet) The poly carbodiimide film (or sheet) of this invention
is obtained by producing the poly carbodiimide varnish in suitable thickness using well-known approaches
(casting, spin coating, roll coating, etc.). As it is made to dry that what is necessary is just to usually dry this
film at temperature required for removal of a solvent, without advancing a hardening reaction not much, 20-
350 degrees C of coating temperature are 50-300 degrees C preferably, for example. If drying temperature is
lower than 20 degrees C, a solvent remains in a film, and the dependability of a film becomes scarce and is
not desirable. Moreover, if drying temperature is higher than 350 degrees C, heat curing of a film will tend
to progress.

[003 1] A detailed inorganic bulking agent may be blended with the poly carbodiimide resin constituent of
this invention in the range which does not spoil the workability and thermal resistance. Moreover, various
additives, such as a lubricating agent for taking out surface smooth nature, a leveling agent, and a defoaming
agent, may be added if needed.

[0032] The moldings which fabricated the polymer of this invention in the shape of a film can be used as a
heat-resistant adhesion sheet. As sheet thickness which can be fabricated on a film or an adhesion sheet,
although it is generally 1-200 micrometers, it is not limited to this and can choose suitably according to the
purpose. Moreover, also about the configuration and size of a sheet, a leadframe, a semiconductor chip, etc.
can be suitably determined according to adherend.

[0033] the various inorganic powder which consists of ceramics, such as metals, such as aluminum, copper,
silver, gold, nickel, chromium, lead, tin, zinc, palladium, and solder, or an alloy, an alumina, a silica, a
magnesia, and silicon nitride, other carbon, etc. in order to achieve conductive grant and thermally
conductive improvement, accommodation of an elastic modulus, especially rate-ization of high elasticity,
etc., when manufacturing an adhesion sheet — the need — responding — one sort ~ or two or more sorts may
be blended.

[0034] Furthermore, these films are formed on a base material and it is good also as an adhesion sheet. In
order to manufacture the adhesion sheet of such a configuration, on a base material, coating of the varnish
may be carried out, a film is formed beforehand, and this may be laminated with a press etc. and may be
manufactured.

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[0035] A metallic foil, an insulating film, etc. are mentioned as a base material used here. As a metallic foil,
each of aluminum, copper, silver, gold, nickel, an indium, chromium, lead, tin, zinc, palladium, etc. may be
used, it is independent or these may be used as an alloy. Moreover, as an insulating film, if it is films which
have thermal resistance and chemical resistance, such as polyimide, polyester, and polyethylene
terephthalate, all can be used.

[0036] Moreover, the metallic foil and the insulating film could be used independently, respectively, and
carried out the laminating of both more than two-layer, for example, two-layer base materials, such as a
metallic foil / insulating film, may be used for them. As such a two-layer base material, copper / polyimide
two-layer base material is mentioned, for example.

[0037] The sheet-like adhesives of this invention serve as a hardened material of low hygroscopicity while
they heat-harden by heat-treatment and discover firm adhesive strength. In order to heat-treat, proper
approaches, such as a heater, a supersonic wave, and ultraviolet rays, may be used. Therefore, the adhesion
sheet of this invention is desirable to adhesion processing of various ingredients, and desirable to fixing
processing of the electrical and electric equipment and electronic parts represented with the semiconductor
chip which especially highly reliable fixing processing is required, therefore requires that it is low
hygroscopicity, a leadframe, etc. The adhesion sheet of this invention is excellent in respect of that it is low
hygroscopicity, that it is rich in flexibility and easy to deal with it, that an adhesive property is good to a
semiconductor device, preservation stability being good, etc.

[0038] (Application) The poly carbodiimide resin manufactured by doing in this way can also be used as

adhesives and the covering material for electronic parts using the thermal resistance.

[0039]

[Example] An example and the example of a comparison explain this invention still more concretely below.
All reactions were performed under the nitrogen air current. In addition, the property of the obtained poly
carbodiimide was measured as follows.
[0040] It measured using FT/IR -230 by IR JEOL.

It measured using heat-curing temperature and glass-transition-temperature (Tg) DSC-200 (Product made
from the SEIKO Electronic industry), and the exothermic peak of trimer-izing was made into heat-curing
temperature.

[0041] GMHHR-H+GMHHR-H+G2000HHR (TOSOH Make) was used for HLC8I20 (TOSOH Make) and
a column as number-average-molecular-weight (Mn) equipment, and the tetrahydrofuran was measured as
an expansion solvent.

It measured using the elastic modulus (E f ) DMS 210 (Product made from the SEIKO Electronic industry).
180-degree Peel reinforcement was measured using adhesive strength Shimazu autograph AGS-100D.
[0042]

[Example 1] Diamine [ of a bottom type (IV) ] (1 1.25g, 20.0mmol), triethylamine (4.05g, 40.0mmol),
trimethylchlorosilane (4.35g, 40.0mmol), and toluene 58g was taught to the 4 opening flask which attached
stirring equipment, the tap funnel, and the reflux condenser, it stirred at 80 degrees C for 3 hours, and
silanizing diamine was obtained.
[Formula 5]

(IV)

To the room temperature, phenyl chloro formate (6.26g, 40.0mmol) was put into the tap funnel after
cooling, and it was under water bath, was dropped over about 10 minutes, and stirred at the room
temperature overnight. After checking a carver mate's generation by IR, trimethylchlorosilane (0.87g,
8mmol) and triethylamine (4.87g, 48mmol) were taught, at 80 degrees C, it stirred for 3 hours and
isocyanate-ization was performed. After checking generation of isocyanate by IR ( drawing 1 ), it cooled to
the room temperature, a carbodiimide-ized catalyst (3-methyl-l -phenyl -2-phospholene-l -oxide) (0.1 9g,
l.OOmmol) and end encapsulant (p-isopropyl phenyl isocyanate) (0.74g, 4.60mmol) were prepared, and the
polymerization of the 80 degrees C was carried out for 3 hours.

[0043] Carbodiimide-ization was checked by the IR spectrum ( drawing 2 ), filtration removed the generated
triethylamine hydrochloride, and the varnish was obtained. The number average molecular weight (Mn) of
this poly carbodiimide was 4170 (n= 7). The preservation stability of the above-mentioned varnish was ten

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days or more, the varnish was cast on the glass plate, and when it dried for 60 minutes at 200 more degrees
C for 30 minutes in 90 degrees C, the film which has ** and **** was obtained. Moreover, the powder
which reprecipitated the varnish by isopropyl alcohol, collected the depositing solid-states and was obtained
by drying was Tg=216 degree C and Tc=320 degree C.
[0044]

[Example 2] Coating of the varnish manufactured in the example 1 was carried out on copper foil with a
thickness of 105 micrometers, subsequently it dried at 250 degrees C by 90 degrees C for 30 minutes for 30
minutes, and the adhesion sheet whose thickness of an adhesives layer is 30 micrometers was obtained. This
was stuck on 42 alloy plate, and by 300 degrees C and the pressure of 50kg/cm2, it presses for 1 second and
stuck. Adhesive strength was 1200 g/cm. When the solder heat test (260 degree-Cx 10 minutes) of this base
material was performed, the good adhesive property was shown. Tg of an adhesives layer was 150 degrees
C, the elastics modulus in 240 degrees C were 0.80Gpa(s), and water absorption was 0.1%.
[0045] [example 1 of comparison] 2, 4-tolylene diisocyanate / 2, and 5g (mixed rate 90:10) (28.7mmol) of
6-tolylene diisocyanate mixture — tetrahydrofuran 20g — it stirred at 60 degrees C in inside for 1 5 hours
with 43mg (3 -methyl- l-phenyl-2-phospholene-l -oxide) (0.22mmol) of carbodiimide-ized catalysts, and the
poly carbodiimide solution was obtained. The number average molecular weight of this polymer was 6,700
(n= 52). The film which cast the varnish on the glass plate, and was obtained for 30 minutes at 90 degrees C
when it subsequently dried for 30 minutes at 250 degrees C, desiccation and was a very weak black film.
When the thermal property of this film was evaluated, they were Tc=300 degree C and Tg=227 degree C.
[0046]

[Effect of the Invention] Highly, the poly carbodiimide of this invention has good workability, and the
solubility to an organic solvent can show the outstanding thermal resistance and the outstanding moisture
resistance, and can use it as heat-resistant covering material in the soldering process at the time of
electronic-parts manufacture etc.

[Translation done.]

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JP,2001 -002747, A [DRAWINGS]

Page 1 of 1

* NOTICES *

JPO and NCZPI are not responsible for any
damages caused by the use of this translation.

1 .This document has been translated by computer. So the translation may not reflect the original precisely.

2 **** s hows the word which can not be translated.
3. In the drawings, any words are not translated.

DRAWINGS

[Drawing 1]

too

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m ft (c- 1 )

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[Drawing 2j

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r*T)

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4000

SI R (cm"}

600

[Translation done.]

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